Used EBARA Frex 300S #9293812 for sale
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EBARA Frex 300S is a high-precision, multi-function machine that can perform grinding, lapping, and polishing simultaneously on wafers. The equipment offers fully-automated processing for 4" to12" wafers. Its simple and efficient single-body design allows for flexible production configurations and optimal floor space utilization. The platform offers a quick, accurate and consistent solution for processing wafers. EBARA FREX300S features a grinding system that employs a high-performance spindle motor equipped with an aluminum oxide grinding wheel, providing precision and accuracy in the finishing process with minimal micro-cracks or sub surface damage. The grinding head is capable of oscillating, allowing it provide a uniform finish across the wafer's surface, and the wafer is held firmly by a vacuum chuck to provide secure placement and processing. The lapping process is provided through the use of a high-precision side winder lagging mechanism and a floating wedge that can be set directly to the workpiece height, allowing for precise positioning to achieve a high accuracy during lapping. A counter-rotating lap plate is used for homogeneous and repeatable surface finishing. F-REX300S provides manual operation for the polishing process via the use of precision-engineered polishers that feature adjustable speed and pressure, allowing for high efficiency and repeatable results. The polishers can further be configured in different directions, making it ideal for specific polishing applications. F REX 300 S provides advanced user functions, fully automated spindle and vacuum control, as well as integrated high-precision linear motors and high-precision measuring systems to ensure accuracy, repeatability and short cycle times. It also has a user-friendly touch control panel, multiple recipe unit as well as long-term statistical reports. Overall, FREX-300 S is an efficient, cost-effective grinding, lapping and polishing machine that offers high precision and consistent results, making it ideal for a wide range of wafers processing operations.
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