Used EBARA Frex 300S #9300644 for sale

EBARA Frex 300S is a state-of-the-art wafer grinding, lapping and polishing equipment designed to produce extremely high quality and precision results with minimal waste and maximum efficiency. The system is ideal for applications that require extremely low dimensions, with the ability to achieve a chip thickness ranging from 70nm to 1500nm. EBARA FREX300S is a semi-automatic unit with a fully programmable grinding/lapping/polishing chamber, servo motors for control, powerful brushless spindle motors for high accuracy and power, variable speed drives for optimized chamber operations, multiple process recipes, and the latest PLC control technologies. The machine includes 3 axes of movement for flexible positioning of the wafer within the chamber, providing a wide variety of wafer plans and shapes in order to produce the highest quality results. F-REX300S also offers a powerful automatic wafer handling tool that allows for quick and easy loading/unloading of wafers and stanchions for easy expansion. In addition, it also has a highly advanced grinding/lapping/polishing head with adjustable RPMs and multiple process recipes that can be configured to accommodate a wide range of materials. FREX-300 S boasts an expansive range of capabilities, enabling it to process materials ranging from silicon wafers, quartz wafers, Multi-Chip-Modules, SOIs and wafers used in the production of MEMS, LED and other microelectronic devices. With a compact design, it can be used in both research and production environments. With its innovative features, superior precision and effectiveness, Frex 300S is the perfect choice for producing high-performance, high-precision wafer grinding, lapping and polishing results. It is an essential tool for any production line looking to maximize efficiency and prepare materials with superior precision and results.