Used EBARA Frex 300S #9311817 for sale
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ID: 9311817
Wafer Size: 12"
Vintage: 2004
CMP System, 12"
(2) Platens
(2) Heads
For SiO2
2004 vintage.
EBARA Frex 300S is a wafer grinding, lapping & polishing equipment designed to provide high performance surface conditioning of wafers while ensuring accurate, consistent results. The unit is automated and user-friendly, allowing for ease of adjustment and operation. The system consists of a fully programmable, flexible spindle and a range of high speed spindles and tooling designed to address a variety of wafer conditioning processes. This includes grinding, lapping and polishing operations depending on the application. The spindle is driven by a three-phase vector motor to provide high accuracy and unparalleled performance over a wide range of grinding, lapping and polishing processes. EBARA FREX300S is equipped with a Dremel type grinding head for low to medium speed operations and a high speed spindle with a frequency of up to 45,000 RPMS for medium and high speed processes. The unit also features adjustable weights for grinding head and grinding wheel balance and a cooling machine for reduction of surface temperatures during wafer conditioning. Finally, the tool offers a range of motion abilities, from manual operation to semi-automatic and full automation. The automatic grinding option allows for fast and accurate adjustments to be made to the machines settings, improving tool life and throughput. In addition, F-REX300S is designed with an inert chamber and a vacuum asset to minimize environmental impact by controlling dust particles in the working environment. Overall, FREX 300 S is a highly versatile wafer grinding, lapping & polishing model designed to provide superior results in a variety of wafer conditioning processes. The user-friendly interface, customizable applications and advanced motion capabilities make the equipment a powerful tool for any surface conditioner.
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