Used EBARA Frex 300S #9382436 for sale

ID: 9382436
Oxide CMP system, 12" EFEM.
EBARA Frex 300S is a wafer grinding, lapping, and polishing equipment designed for the production of ultra-precision planar and curved surfaces on semiconductor wafers. It features a duel-axis design that effectively combines second harmonic control into the process, resulting in highly repeatable shaping and finishing accuracy. The system can accommodate a wide variety of substrates, including silicon and gallium arsenide, ranging from individual wafers up to 450mm in diameter. It is based on advanced technologies such as double-sided lapping, electrochemical machining, and state-of-the-art dynamic process control. This allows for significant improvements in surface quality, throughput, and productivity. The unit is equipped with an advanced High Speed Grinding Head that enables it to process quickly and accurately. It can be adjusted through a wide range of settings, including depth and force, speed, and stroke limit, for more precision and control. This ensures that the desired and consistent results are always achieved. For lapping and polishing operations, EBARA FREX300S is equipped with an integrated Harmonic Printer and Planarizing Machine. This powerful tool is able to generate consistent and accurate surfaces in less time and with fewer iterations, drastically reducing the cost and time of production. The asset also includes a powerful software interface that allows it to be easily integrated with other tools and systems, resulting in efficient and faster production. Additionally, F-REX300S includes a number of measurement and inspection tools, such as a profilometer, tooling reference model, and laser profiler, allowing for thorough and accurate inspections. This ensures that the equipment is always producing quality parts in a timely manner. F REX 300 S is an advanced and powerful system designed for the production of ultra-precision planar and curved surfaces on semiconductor wafers. It is equipped with an integrated Harmonic Printer and Planarizing Unit, and a High Speed Grinding Head for fast and precise performance. The machine also includes a range of measurement and inspection tools, ensuring that the quality of parts produced is consistent and reliable. This allows for increased efficiency and accuracy in the production process.
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