Used EBARA Frex 300S #9382439 for sale

ID: 9382439
Wafer Size: 12"
Vintage: 2007
CMP System, 12" 2007 vintage.
EBARA Frex 300S Wafer Grinding, Lapping & Polishing equipment is developed by EBARA Corporation and is designed specifically for the grinding, lapping and polishing of a variety of substrates. This system provides the capability of boosting both abrasive and lapping tools, while eliminating hazardous dust and residuum due to its enclosed design. EBARA FREX300S utilizes work-piece oscillation, with low-vibration motion technology and an enclosed process chamber for superior grinding and polishing performance. This unit is compatible with both glass and hard substrates, such as sapphire and silicon. The platform includes a variety of standard features, such as a programme memory, an action controller, an encoder, and a user-friendly and intuitive interface. The elaborate design of F-REX300S ensures superior grinding results and provides a wide range of processing capabilities. It is equipped with a state-of-the-art robotic arm that is capable of achieving a fast and precise grinding path. The platform also offers a tablet designed job recorder, as well as a real-time video inspection machine. For added convenience and flexibility, this tool can be operated in either a full-automatic mode or a manual mode. The robust design of FREX 300-S is complemented by wet or dry grinding and high-precision load cell, allowing for optimum accuracy and precision. Its motor-driven grinding quill ensures optimal results even at high speed. Furthermore, Frex 300S is equipped with a motion-control-asset for precise operation and excellent repeatability. This model has a unique grinding spindle that can be used for both normal grinding and face grinding. The high-power grinding spindle allows for real-time grinding and polishing at up to 15,000 rpm. The equipment also features a variable speed control to accommodate the material being processed. Overall, EBARA FREX-300 S Wafer Grinding, Lapping & Polishing system is an excellent solution for the grinding, lapping and polishing of various precision parts. Highly automated and robust, its modular design allows for a variety of application possibilities. This unit promises peak performance and accuracy, as well as superior quality outcomes in grinding and polishing.
There are no reviews yet