Used EBARA Frex 300S #9402500 for sale

EBARA Frex 300S is a semi-automated wafer grinding, lapping and polishing equipment designed to support the production of high quality semiconductor devices. The system features a wide range of features and accessories to help provide excellent process control results. At the heart of the unit is a grinding/polishing motor that is capable of generating forces from 2 to 10 kilopascals and is designed to offer high precision, repeatable grinding and polishing results. The motor is equipped with stepper motor control for precise force control, which allows for precise polishing pressure settings. The trimming and end-face finish mode can be programmed in to the machine, providing advanced capabilities such as level and inclined polishing. EBARA FREX300S is also equipped with a true-top lapping tool for even pressure, gap free lap and precision control. This asset is specially designed to prevent the formation of lapping patterns and ensures a fine, homogenous finishing of the wafers. The true-top lapping model is also capable of variable force control, allowing for accurate and stable grinding, lapping and polishing. Additionally, F-REX300S features both manual and automated wash and rinse capabilities to ensure the highest levels of cleanliness. The equipment includes a large water tank and filtration system, allowing for maximum cleaning efficiency and minimum wafer damage. The tank is equipped with a temperature control unit, which helps to reduce contamination and corrosion. EBARA FREX-300S also offers an array of process monitoring and control systems, such as force monitoring, current monitoring and wafer mapping. These systems ensure that all the required parameters are observed, ensuring optimal performance and repeatability. Additionally, FREX-300S is compatible with a range of computer-aided software systems, permitting automated evaluation of the machine performance and data recording. Overall, EBARA F REX 300 S is an excellent tool for the production of high quality semiconductor devices and wafers. The asset provides a wide range of features to help ensure precision grinding, lapping and polishing, while offering a variety of process monitoring and control options.