Used EBARA Frex 300S2 #293606311 for sale

EBARA Frex 300S2 Wafer Grinding, Lapping and Polishing Machine is designed to provide a precision, high-performance grinding, lapping and polishing solution in a production environment. This equipment is composed of an integrated grinding unit, lapping plate, and polishing head and can be operated via computer control, allowing for cuts of up to 5 μm on wafer thickness. The machine is composed of two main parts, the Grinder Unit and the Lapping and Polishing Head. The Grinder Unit is the workhorse of the system, with the capability to grind down excess material from the wafer's surface area. This unit employs a diamond grinding wheel, capable of removing over 0.001um of material to achieve a high precision finish. With a custom motor, optimized speed and feed rate, as well as a spindle and drive unit—the Grinder Unit is controlled via a touch panel that allows users to program trajectory control of the grinding wheel. The Lapping and Polishing Head is the second arm of the unit, designed to achieve greater precision when applying the finishing touches to each wafer. This unit is equipped with a lapping plate, allowing users to apply lapping agents to create an ultra-smooth surface. Lapping agents are composed of diamond compounds, abrasives and lubricants, capable of removing a few 10th of a micron, in order to achieve mirror-like surfaces. The lapping plate rotates with highly-regulated pressure, while the polishing head applies polishing agents to achieve the desired finish. The polishing head is controlled by the touch panel, with programmable parameters and conditions, allowing for a controlled polishing process. EBARA F-REX300S2 Wafer Grinding, Lapping and Polishing Machine is an invaluable tool for achieving highly precise levels of wafer grinding and polishing. Its combination of power and precision is capable of producing wafers that meet the highest standards, while its custom motor and adjustable speed led to superior repeatability. With the Grinder Unit, Lapping Plate and Polishing Head, operating under computer control, this machine is capable of delivering the best results in precision grinding, lapping and polishing.