Used EBARA Frex 300S2 #9237840 for sale
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ID: 9237840
Wafer Size: 12"
Oxide CMP system, 12"
EFEM:
(4) SMIF TDK
(4) ASYST Load ports
YASKAWA Dry robot
Position control: Motor ball screw
Wafer transfer:
Transporter STP
(4) Pushers: A, B, C, D
(2) LTP: LTP-A & LTP-B
C-LTP
Turn over
Polishing unit:
Top ring:
(4) Retainer rings: SUS / PPS
(4) Head types: GII
Dresser:
(4) Disk types: Paradium coating
(4) Holder types: SEASOL (Magnetic)
(4) Scan disks
Table:
(4) Stainless steels
(4) Lapping surfaces
(4) YASKAWA Motors
Hardware:
Cleaner 1:
(2) Method: Roll scrub
MEGASONIC
Bevel sponge
SC-1 < 60°C
Cleaner 2:
(2) Method: Roll scrubs
Anti-static
Cleaner 3:
(2) Method: Roll scrubs
MEGASONIC
SC-1 < 60°C
Wafer roller:
(8) Hardness Duro90
ETC:
Position: Front, left, standalone
User interface: Touch panel, 15"
HMIPC Spec: Celeron 1.2 GHz
Recipe backup: FDD / MO / USB Port
End point monitor:
TCM:
(2) Controllers: ME-20
Data back up: USB Port
ITM Type: NANO 9010bxls
APC/CLC: BC&FS
(4) Atomizers
(4) Slip out sensors: CCD Camera
Utility:
D.I.W Connection
(4) Exhaust connections
Direction: Downward
Slurry delivery type: CLC.
EBARA Frex 300S2 is a powerful and efficient wafer grinding, lapping and polishing equipment. This system utilizes a combination of a proprietary rotor and stator to create a unique grinding/polishing action. The unit is designed to offer high-precision grinding featuring low vibration, low noise, high-polishing efficiency, and the ability to work with a wide range of wafer types. EBARA F-REX300S2 allows users to process wafers with a maximum diameter of 300mm and a minimum diameter of 150mm. The machine also provides users with a choice of two process modes - grinding and polishing. The grinding rotor uses a 45-degree chamfer profile to effectively remove metal from the wafer surface. This allows for the accurate fabrication of wafer faces as well as the effective removal of micro-ruffles and burrs. The lapping process is then lathed to create the final polishing surface. This is done by the introduction of negatively charged abrasive ions which are drawn to the positive surface of the wafer. FREX-300 S2 utilizes an adjustable air gap between the rotor and stator to create an optimal grinding and polishing profile. The tool also features a parameter setting option to allow for quick maintenance. The versatility of the asset also allows users to adjust the speed of the process, as well as the pressure control to create the desired finish. EBARA FREX-300 S2 also features a low-vibration and low-noise process while in operation. Additionally, the model features a high-efficiency filtration equipment to ensure that contaminants are removed during the process. Frex 300S2 wafer grinding, lapping and polishing system is an efficient, versatile and powerful unit with features that make it suitable for a wide variety of applications. It provides users with the option to precisely fabricate wafer faces while also removing micro-ruffles and burrs, grind and polish in two process modes, and operate with low vibration and noise. It's also designed with adjustable air gaps and adjustable speeds and pressure control settings, allowing users to quickly adjust settings according to their unique needs. In summary, EBARA FREX 300 S2 wafer grinding, lapping and polishing machine is an ideal tool for industrial applications requiring high-precision, high-efficiency grinding and polishing.
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