Used EBARA Frex 300S2 #9245499 for sale
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ID: 9245499
Vintage: 2007
CMP System
Process: Ox
SiC Material
(3) Slurry lines for each main table
With slurry return line
Slurry feed pumps:
Flow control valve CLC (MALEMA)
(2) Line per polisher
Load/Unload port:
TDK TAS300 E4 x4 Load port
AMHS: OHT
Carrier:
RF-Tag reader
Advantag ATR9100
Cleaner 1:
Chemical line (0.4-1 L / min)
DIW Line
SC1 (NH4OH (29%)
H2O2 (31%)
DIW (1:4:20)
Cleaner 2:
Chemical line (0.4-1 L / min)
DIW Line
DHF (5%)
Cleaner 3:
Chemical line (0.4-1 L / min)
DIW Line
SC1 (NH4OH (29%)
H2O2 (31%)
DIW (1:4:20)
Includes:
Wafer loss sensor
Pad temperature sensor
Wafer rotation sensor
Signal tower: ProMos Spec(RYGB) front / rear side
Wafer release assist nozzle
Side operation panel
With removal type monitor
SC-1 Mixing system for CL1, 3
Light curtain
UPS
HMI PC
Atomizer
Power supply: AC 208 V, 3 Phase, 60 Hz
2007 vintage.
EBARA Frex 300S2 is an advanced wafer grinding, lapping and polishing equipment. It is designed to meet the demanding requirements of semiconductor and LED manufacturers. The system features a powerful grinding motor, an advanced control unit, and a robust machine bed and spindle structure. Many of its components are modular, making it easier to expand and upgrade the machine when needed. The tool's high-precision grinding capability can rapidly process various substrates such as silicon, gallium nitride (GaN), polymer, and other crystalline materials. The main motor can produce up to 2,000 rpm for rapid processing, while the entire asset's micro-computer control model enables users to program their own grinding processes. The equipment is also capable of lapping and polishing wafers to a fine finish. It features a stainless steel lapping plate that is powered by a 3.7 kW lapping motor capable of handling wafers up to 300mm in diameter. An integrated air-frame and a central vacuum system provide a secure environment for the lapping process. The robust machine bed and spindle ensure vibration-free processing. The unit is also equipped with special EMI-shielded cable, built-in safety-functions, an integrated dust-collector and an automated exhaust machine that ensures maximum safety for users. Overall, EBARA F-REX300S2 is a powerful, all-in-one grinding, lapping and polishing tool that features precise performance, robustness, and modular expandability. It can be used to quickly process substrates for semiconductor and LED manufacturers and provides a safe and reliable environment to perform these operations. Furthermore, its micro-computer control asset provides users with customisable grinding processes.
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