Used EBARA Frex 300S2 #9290831 for sale

EBARA Frex 300S2 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to accommodate wafers of various sizes and provide uniform surface flatness. It features a three-axis pre-alignment system for accurate and repeatable alignment of wafers, and a high-precision linear motor feed unit for precise wafer edge positioning. The grinding and lapping stages utilize a combination of precision diamond wheels and polishing pads to smooth and flatten the wafer surface. EBARA F-REX300S2 is equipped with a distributed drive machine that allows for independent control of rotation, tilt, and spindle speed in order to accommodate the optimal process depending on the application. To maintain uniform flatness of the wafer and reduce dishing and chatter, an advanced motorized vacuum clamp tool is employed. Additional features of FREX-300 S2 include a dust-tight, air-purged enclosure, precise temperature control, a user-friendly touch screen graphical user interface, and advanced diagnostics for increased process control. Additionally, the asset is designed for rapid loading and unloading, offering repeatable inline processing of single and multiple wafers. Overall, F-REX300S2 is an excellent choice for rapid grinding, lapping, and polishing of wafers due to the precision motion control, automated fabrication process, and precise temperature control. With superior results in terms of surface flatness and repeatability, FREX 300 S2 provides the precision and flexibility necessary for a wide range of wafer processing applications.