Used EBARA Frex 300S2 #9298514 for sale

EBARA Frex 300S2 is a versatile, high-performance wafer grinding, lapping, and polishing equipment. It is designed to meet the specific requirements of semiconductor and other microelectronic applications, including wafer and substrate preparation, thinning, and post-process smoothing. The precision-engineered design of EBARA F-REX300S2 features a unique combination of advanced features and design elements. The work chamber is fully enclosed and operation is controlled by an easy-to-use user interface. The operator can view the grinding and polishing process through the large window. The grinding system incorporates a perforated plate or "Honeycomb" plate for grinding and lapping of multiple wafers in a single batch. This reduces the time necessary to process multiple wafers, even at small batch sizes. The combination of a built-in safety door, fan filters, and air locks ensure a dust-free operating environment. The digital platen positioning unit included with each FREX-300 S2 ensures high accuracy and extremely uniform polishing over all wafers and substrates. The machine of individual spindle motors with precision direct drives and ball-bearing support ensures optimal torque for all grinding and polishing operations. These features make EBARA FREX-300 S2 suitable for processing of all types of wafers, substrates and materials, including Si, GaAs, and specialty materials. EBARA FREX 300 S2 further incorporates advanced process monitoring and control functions, with real-time display of all process parameters, and functions for fault correction and data logging. Automated calibration of the grinding/polishing tool makes it easy for the user to recall and set parameters for different applications. The asset further includes a PLC and AC servo model for sensitive monitor and control of process parameters for maximum productivity and accuracy. Overall, FREX 300 S2 is a powerful, reliable and precise equipment for wafer grinding, lapping and polishing operations. Its advanced, easy-to-use controls and high accuracy motion control make it the perfect choice for processing of a variety of wafers and substrates.