Used EBARA Frex 300S2 #9311211 for sale

EBARA Frex 300S2 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for processing wafers from thicknesses from 75µm to 10mm. It is designed for the production of flat, meandering, or grooved wafers with a high-precision tolerance of +/-2µm across the wafer surface. The machine includes a robust, high-velocity grinding spindle, combined with a multi-position swivel table to provide precision, repeatable angles of up to 180°. The grinding cylinders are self-contained units with a diamond grit spread evenly along the grinding surface, allowing for very accurate grinding with smooth edges and very tight tolerances. A laser encoder is included to provide accurate measurements of the wafer length and to maintain wafer levelness. Using a range of spindle speeds and feed rates, the machine can grind wafers from 75µm to 10mm. The grinding vibrator is also adjustable to accommodate changing grinding characteristics due to the changing hardness of the wafer. The lapping and polishing components of the machine allow for higher wafer tolerances of +/-2µm. A range of diamond and boron-carbide abrasives can be used to achieve the required finish. An automated doser system is included to accurately dose the proper amounts of abrasive, with variable pressures and speeds to achieve the desired finish. To ensure repeatability and unit accuracy, EBARA F-REX300S2 includes a PLC controlled machine along with an on-board process log, as well as an automatic e-stop tool. The asset is designed to reduce operator intervention, with a built-in model to self-correct for ripple grinding and errors. The e-stop equipment allows the operator to safely stop the machine in case of an emergency. In addition, the machine has several safety features, such as an on-board residue cleaning system, automatic protection of parts exposed to unintentional abrasion, and board accident prevention features. Overall, FREX-300 S2 is a highly advanced machine designed to provide superior results in wafer grinding, lapping and polishing.