Used EBARA Frex 300S2 #9351475 for sale

EBARA Frex 300S2 is a wafer grinding, lapping and polishing equipment designed specifically for precise ultrasonic machining of wafers and thin films. It is suitable for a wide range of wafer applications including solar cells, thin film transistors, thin film integrated circuits, optical semiconductors, and other advanced wafer-type devices. The system features a high-precision linear motor stage for high-speed and high-precision quartz-ceramic grinding, lapping and polishing. This motor-driven unit enables a wide range of spindle speeds, including two continuous speeds and six step speeds. Additionally, the machine includes a step motor and joystick for full-automation of the spindle rotation speed. EBARA F-REX300S2 offers an optimized grinding/lapping solution including an enclosed dust-free workspace, adjustable grinding wheel and flow rate selector, and a multiple-wire electrode spindle. The tool features a high-precision linear motor stage for maximum repeatability and a low force feed grinding mechanism for precise and consistent results. Additionally, the asset provides programmable control over the operation parameters such as spindle speed, feed rate, wheel angle, and tilt angle. FREX-300 S2 also includes an advanced air bearing guide model for precise movement of the spindle and a vibration-isolation design for reduced equipment vibrations. In addition, the system is equipped with an LED indicator to show grinding stage and grinding pad status, as well as the remaining time to completion. Finally, the unit is compatible with a range of grinding and lapping products such as grinding and lapping stones, powders, carbon polishing abrasion pads, and polyurethane pads for various abrasive operations. Overall, EBARA FREX-300 S2 is a highly precise wafer grinding, lapping and polishing machine designed to meet a wide range of needs. It has an optimized grinding and lapping solution, a high-precision linear motor stage for maximum repeatability, a low force feed grinding mechanism for precise and consistent results, and programmable control over operation parameters. Additionally, its enclosed dust-free workspace, adjustable grinding wheel and flow rate selector, and advanced air bearing guide tool help ensure the highest accuracy in the production of thin film and wafer based devices.