Used EBARA Frex 300S2 #9364498 for sale
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ID: 9364498
Wafer Size: 12"
Vintage: 2015
CMP System, 12"
Polisher:
(4) Turn tables
(4) Top rings (GX 8-Area)
(4) Scan dressers
(4) Atomizers
(2) Liner transportors
(2) Turn overs
STP
Controller
(4) Slurry scan nozzles
(4) Wafer slip out sensors
(2) Operation panels
Cleaner:
R/R With megasonic jet
R/R
2FJ
IPA/SRD
EFEM:
Dry robot
(4) Loadports
(2) Operation panels
ITM NOVA
Slurry nozzle motor type
Auto calibration
Options:
GX Carrier
Anti static material for wafer exposed surface
Eddy current end point monitor (R-ECM1D)
(2) ME-30 for S-OPM
TCM EPD Controller
Malema slurry flow controller
Light curtain for EFEM
Camera
2015 vintage.
EBARA Frex 300S2 is a leading-edge wafer grinding, lapping, and polishing equipment designed to provide precise and repeatable results in the processing of high-end semiconductor wafers. EBARA F-REX300S2 utilizes a high-performance, three-axis motion controller and microstep drive, allowing for exceptionally precise control of the grinding, lapping, and polishing process, leading to a quality and repeatability that is difficult to achieve with conventional systems. FREX-300 S2 features a 300mm (12") platen design providing a large process area for the abrasion of wafers or thin substrates. It also features a powerful 400W spindle motor providing a high torque for fine finishing. The spindle belt drive system allows for a precision of 0.01μm, while power assist technology and a computer numerical control (CNC) unit allow for exceptional accuracy even at speed. FREX 300 S2 is engineered for easy maintenance and operation. It has a programmable hierarchical machine, allowing for easy adaptation and efficient operation. The machine has a robust and rigid design that minimizes vibration without compromising on accuracy. Additionally, the design allows for quick and easy access to all components, making maintenance and set-up a fast and convenient process. EBARA FREX-300 S2 also features a state-of-the-art Safety Tool. It contains a splash chamber and central air control valves, reducing operator inputs and making operation easier. The optional RC load monitoring asset ensures that tasks are monitored and controlled, preventing damage or malfunction that could cause defect or uneven surfaces. In conclusion, F-REX300S2 represents the state of the art in wafer grinding, lapping, and polishing systems. Its advanced features and intuitive design provide the accuracy and precision required for the production of high-end semiconductor wafers, as well as a safe and reliable user experience. With its unparalleled performance, reliability and user-friendly features, EBARA FREX 300 S2 is an ideal choice for any manufacturer looking for an efficient, reliable, and repeatable production.
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