Used EBARA Frex 300S2 #9364502 for sale
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ID: 9364502
Wafer Size: 12"
Vintage: 2015
CMP System, 12"
Polisher:
(4) Turn tables
(4) Top rings (GX 8-Area)
(4) Scan dressers
(4) Atomizers
(2) Liner transportors
(2) Turn overs
STP
Controller
(4) Slurry scan nozzles
(4) Wafer slip out sensors
(2) Operation panels
Cleaner:
R/R With megasonic jet
(2) R/R
IPA/SRD
EFEM:
Dry robot
(4) Loadports
(2) Operation panels
ITM NOVA
Slurry nozzle motor type
Auto Calibration
Options:
GX Carrier
Anti static material for wafer exposed surface
Eddy current end point monitor (R-ECM1D)
(2) ME-30 for S-OPM
TCM EPD Controller
Malema slurry flow controller
Light curtain for EFEM
Camera
2015 vintage.
EBARA Frex 300S2 is an advanced multi-functional precision wafer grinding, lapping and polishing equipment designed to produce high-precision, high-quality wafers. It features a patented three-sided polishing head that utilizes low-pressure air sanding to help eliminate surface irregularities, deepening valleys and roughening flat surfaces. The system also features an air-driven grinding head that can handle wafer sizes up to 200mm and is capable of polishing to a flatness of less than 5μm/μm. EBARA F-REX300S2 has an integrated dual-belt lapping unit each with a customizable surface finish. The lapping belts are electroformed titanium plates that are stretched over the polishing and grinding surfaces to produce a consistent finish. The belt design also allows for a much increased frequency of use at temperatures up to 600 °C, which enables for higher efficiency lapping and polishing. FREX-300 S2 also includes a remote operations machine that enables operators to conveniently operate the grinding and lapping machine from a distance. This is especially beneficial when dealing with large wafers that require multiple passes due to its size or complexity. This remote operations tool also allows operators to adjust parameters to obtain a higher degree of precision, such as speed, feed depth and capacity, all without having to manually set each parameter. The asset is easy to use and maintain, and includes an automated model control equipment to alert operators when grinding or lapping adjustments are necessary. The software also features real-time process monitoring, making FREX 300 S2 more efficient and easy to use. Overall, EBARA FREX 300 S2 is an ideal choice for those seeking to achieve superior precision and quality in grinding, lapping and polishing of wafers. With its robust set of features, it provides an efficient and cost-effective solution for precision wafer fabrication. EBARA FREX-300 S2 is the perfect choice for those looking to achieve the highest standards in wafer processing.
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