Used EBARA Frex 300S2 #9390396 for sale

EBARA Frex 300S2 is a wafer grinding, lapping and polishing equipment that can accurately process semiconductor device surfaces and other components with perfect uniformity and superior surface finish. This single-side grinding and polishing tool is engineered to offer automated processes to handle a wide range of components and materials. EBARA F-REX300S2 can process both ferrous and non-ferrous materials using non-contact grinding techniques to get high-precision finishes. It produces surfaces with flatness variation of less than 0.1µm and a mirror finish of 1nm Ra or better. This powerful machine has an operating range of 0.3 to 3 mm and is equipped with an advanced belt drive to provide reliable and precise results. FREX-300 S2 is ideal for tight tolerance grinding applications as it's equipped with an integrated vision system to inspect before and after every grinding cycle. This makes sure the desired grinding aspects are met and the processed material reaches required standards. Besides, this machine is designed for safety with fully covered layout and sensors to make sure the unit is working safely. It also comes with advanced features like PID controlled temperature regulation and closed-loop feedback machine for repeatable results. The machine includes a PLC and touch screen controller for controlling parameters for automated operation. EBARA FREX-300 S2 has an increased capacity for cutting and grinding, with maximum part size of up to 300 mm and a variable-speed setting that enables the operator to make fine adjustments. All these features make this wafer grinding, lapping and polishing tool a reliable and robust tool for high quality and precise surface finish on both semiconductor device surfaces and other components.