Used EBARA Frex 300SII #9244830 for sale
URL successfully copied!
Tap to zoom
ID: 9244830
Wafer Size: 12"
Vintage: 2009
CMP System, 12"
Process: Cu
Hirata
(3) Loadports
(2) G3 Heads
RECM
Missing parts:
Hard Disk Drive (HDD)
Nano 9010b
2009 vintage.
EBARA Frex 300SII is a powerful and precision-engineered wafer grinding, lapping and polishing equipment. It is designed to process up to 300mm diameter wafers with minimal operator intervention. EBARA FREX 300 SII utilizes an integrated, high-precision spindle system. This spindle unit (5-axis linear motor, small pitch ball screw, eddy current brake, and encoder with air bearing) offers up to 10 micro-step accuracy for superior surface finishing and exceptional surface planarity. The machine also boasts a three-stage lapping process. First, the wafer is subjected to semiconductor wafer planarization. This process reduces the topographical variations in the wafer, creating a flat surface. Next, the wafer is ground to remove defects, such as random edge chippings, particles, and irregularities. Finally, the wafer is polished to achieve a better finish. The lapping process results in improved metrological accuracy and higher throughput. The tool further offers a wide range of optional features. The proprietary CFRP base ensures vibration dampening and a higher level of dimensional stability, resulting in smoother and more accurate rotational movements. A liquid air cooling asset helps dissipate heat generated during the grinding and polishing process. The model also offers an extended range of consumable and part-replacement options, allowing users to customize the equipment to their particular application needs. Finally, the system offers a top-class range of safety features, including a proximity sensor and emergency stop switch. The proximity sensor detects the presence of an operator in the vicinity, while the emergency stop switch allows users to quickly terminate operation in the event of an unexpected accident or emergency. Overall, FREX 300-SII is an incredibly robust and precise wafer grinding, lapping, and polishing unit. It offers an unmatched degree of accuracy and precision, along with a wide range of safety features to ensure a safe and efficient wafer processing experience.
There are no reviews yet