Used EFTY LGP-15S-I #9263631 for sale

EFTY LGP-15S-I is a state-of-the-art wafer grinding, lapping and polishing equipment. This fully automated machine has a total processing capacity of up to 575 (standard wafer size) wafers per hour, and offers superior process control and a high degree of consistency. The system features an impressive wafer handling unit, where, a single wafer is first measured and aligned, before being loaded onto a single grinding wheel that is suited to the specific formula to be used. The grinding wheel is then set to the exact parameters necessary to achieve the required wafer thickness and to adjust the surface topography to the desired specifications. Using an advanced lapping process, the wafer then passes through two rotating diamond laps for precise surface smoothing. A series of independent brush stations are used to properly channel and clean away manufacturing debris, while also insuring maximum surface contact for the lapping process. Finally, polishing is performed using a series of progressively finer diamond polishers and smooth cloth abrasive brushes. This ensures that the wafer surface is uniform, highly reflective and free of any particles. LGP-15S-I also boasts a powerful and easy to use control interface. With this device, processes for cutting, grinding and polishing can be quickly set up and efficiently managed. This also allows operators to maintain larger amounts of process data and to modify parameters and settings easily. The machine also features a fast and efficient cooling machine that has been designed to evenly cool wafers while busy processing them. Overall, EFTY LGP-15S-I is a top-of-the-line wafer grinding, lapping and polishing tool that provides accuracy and consistency as well as efficiency and reliability. With its advanced design and automation capabilities, it has become the solution of choice for many semiconductor companies.