Used EJW-1200EFN-4AL EJW610IFN #9208854 for sale

EJW-1200EFN-4AL EJW 610IFN is a state-of-the-art wafer grinding, lapping, and polishing equipment from Engis Corporation. It is the ideal solution for grinding and polishing single-side, precision sealed, double-side, and full wafers. This system is highly flexible and can be easily reprogrammed to accommodate a variety of substrates and process requirements. It also features a number of advanced design features which enable it to process large quantities of wafers quickly and accurately. The unit includes a high-tech double-station vertical grinding/polishing head, which is designed to achieve uniformity while grinding and polishing different substrates. This head is mounted on a robust safety frame that provides excellent stability, reducing the risk of over-travel and damaging the wafer. Additionally, the grinding/polishing head is equipped with an advanced control machine featuring real-time diagnostics and data logging capability for easy process management. EJW-1200EFN-4AL EJW 610IFN features a high-precision XYZ computer-controlled positioning tool allowing for easy planning of wafer machining operations. It is fitted with a high-speed, low-noise, high-torque servomotor that enables precise and repeatable movement of the tools. Its advanced control asset combines optical sensors and encoders to ensure accurate positioning of the tool during the entire grinding, lapping, and polishing operations. The model also includes a built-in protection equipment which is designed to protect the system and wafers from being damaged in case of overloads or unexpected machine stops. At the heart of EJW-1200EFN-4AL EJW 610IFN is a powerful, energy-efficient integrated grinding, lapping, and polishing unit. This machine is capable of processing metal and non-metallic materials, such as glass and quartz, to produce superior wafer quality. The tool utilizes a two-stage lapping process that produces low-level roughness and superior flatness results. Additionally, an automatic grinding, lapping, and polishing asset eliminates the need for manual intervention and ensures a repeatable process. EJW-1200EFN-4AL EJW 610IFN model can easily be linked to computer systems for workflow automation, data tracking, and process optimization. The equipment also supports the use of specialized software packages that will enable users to reach very high levels of performance. This system has been rigorously tested for precision and reliability and is ready to serve in challenging production environments. With its advanced features and uncompromising build quality, EJW-1200EFN-4AL EJW 610IFN wafer grinding, lapping, and polishing unit provides exceptional performance.