Used ELB SCHLIFF SWDD030 #9305341 for sale

ELB SCHLIFF SWDD030 is a low profile wafer grinding, lapping and polishing equipment. This system is designed for grinding and polishing of wafers, which also allows for lapping and polishing. ELB SCHLIFF unit can process wafers in sizes ranging from a 25.4-200 mm diameter with a minimum thickness of 0.1 mm. The technology utilised is a combination of low-contact grinding and chemical mechanical polishing technology, which facilitates a high level of precision, accuracy and repeatability. The ELB machine features an electronic two-axis gas-hydraulic table with a step resolution of 0.002″ (0.051mm). A low contact grinding spindle setup ensures minimum heat buildup and minimizes stress on wafers and machines for enhanced concentricity and roundness. The low contact grinding technology ensures uniform wafer thickness and minimizes the residual stress that can cause bowing when grinding with traditional technologies. The polishing technology also employs the two-axis Eddy-Current-controlled polishing table, which facilitates alignment-free polishing of the wafers. Additionally, a fast unbalanced spinning technique is employed here, which ensures more efficient material removal with a higher average removal rate. ELB SCHLIFF tool also includes a variety of single-channel, three-channel and three-step polishing heads, enabling the user to take advantage of high process flexibility with perfect repeatability, making it ideal for research and development departments, as well as industry with high-precision grinding and polishing requirements. A combined offline conditioning process is available, which allows for abrasive and wafer cleaning processes to be conducted outside the grinding and polishing operations, providing increased process flexibility and lower production costs. SWDD030 asset is a high-precision, low-profile tooling equipment, ideal for a range of applications in semiconductor, MEMS and optoelectronics industries. The model allows for high accuracy, repeatability and low material removal rate, delivering high-precision wafers for large-scale and high-volume production.