Used ELLIOT 8-20 #168441 for sale

ELLIOT 8-20 wafer grinding, lapping and polishing equipment is a state-of-the-art integrated machine designed for the production of superior quality, ultra-smooth wafers at high efficiencies and throughputs. The system includes a multi-index wheel feeder to automatically feed silicon wafers into the unit. It also includes a unique grinding and lapping spindle enabling a range of grinding, lapping and polishing operations, and can accept different wheel types for a variety of applications. A powerful, highly accurate digital servo machine assures precise, reliable and repeatable production results over an extended period of time. This digital servo tool is designed for high precision control of the grinding, lapping and polishing parameters. In addition, load and unload operations are quick, easy and tool-free. The grinding, lapping, and polishing process begins with the automatic positioning of the wafer into the machine's grinding spindle. An individual grinding wheel then grinds the wafer to the predetermined size or depth, while constantly navigating and controlling the grinding parameters on each individual cycle. The lapping spindle is then activated to lap the wafer at different angles and speeds, in order to smooth out any roughness caused by the grinding process. The lapping and polishing process is completed by an adjustable polishing wheel that is optimized for the particular material and shape of the wafer. The entire grinding, lapping and polishing process takes place in an enclosed environment, ensuring consistent and reliable production results. The machine is also equipped with a process monitoring asset, as well as an optional wafer quality assessment model for the detailed inspection of each wafer. In addition, the equipment supports the integration of manual, automatic and semi-automatic processes and can be easily connected to existing factory-wide production infrastructures. 8-20 wafer grinding, lapping and polishing system is a highly efficient, flexible and comprehensive solution for the production of high-precision, ultra-smooth wafers at high throughputs. It makes use of state-of-the-art technology, ensuring exceptional quality wafers. As a result, it is an ideal solution for a range of applications in the semiconductor, solar and optical industries.