Used ENCO 160-0201 #9172984 for sale

ENCO 160-0201 Wafer Grinding, Lapping & Polishing Equipment is a multi-purpose, high-precision system for grinding, lapping, and polishing of semiconductor wafers, ceramic substrates, and sapphire lenses. The unit features a 10" grinding wheel station for rapid and efficient wafer grinding, lapping, and polishing. It also features a multi-axis, high-precision, multi-directional, automated sample-holding stage and 4" lapping wheel station for precise lapping and polishing operations. The machine is designed for manual or semi-automated sample transfer, and can be programmed for repetitive offline operation. Built with precise motion control, variable frequency and speed, data acquisition, automatic error correction, and repeatable motion and force, 160-0201 enables applications requiring low levels of dish-out, straightness, planarity, and flatness. The tool offers several features that enable both manual and automatic operation. Integrated linear motors and encoders enable high precision movements, and a multi-axis stage allows for automatic sample loading and unloading. Additionally, the asset offers programmed measurement functions including flatness, concentricity, parallelism, perpendicularity, squareness, and taper measurements, as well as a full range of optical, surface, and atomistic contouring options. With an integrated motorized door, the model can be accessed for maintenance and service. Data acquisition and reporting is also available with a variety of measurement criteria. ENCO 160-0201 is capable of repeatable precision grinding, lapping and polishing of various materials, with a consistently high level of performance across all process steps. With flexible operation modes, the equipment can adapt to almost any grinding, lapping, and polishing application. The system offers superior precision and repeatability, enabling processes that yield results consistently within tight tolerances. This makes 160-0201 a powerful and reliable solution for any wafer grinding, lapping, and polishing application.