Used ENCO 9514506 #9221221 for sale

ENCO 9514506 is a wafer grinding, lapping and polishing equipment designed for efficient and precise processing of semiconductor materials. It is suitable for semiconductor materials like silicon, germanium, and gallium arsenide and for new III-V materials of various properties. The system consists of two grinding wheels to allow for simultaneous double-sided processing and two polishing units for post-fabrication polishing of wafers. The grinding wheels are equipped with integrated motor regulators for variable speed adjustment of the rotation, ranging from 0 to 1200 RPM for the grinding steps according to the material properties and the desired surface quality. The lapping station incorporates a self-feeding deionized water tank for improved water lubrication of the tooling during the lapping process. The unit is designed for maximum accuracy and repeatability of results with increased uniformity in roughness, roughness depth, and surface quality values. 9514506 machine also includes a sub-micron filtration unit to ensure cleanliness of the processed materials during the lapping process. In addition, the tool includes an integrated coolant filtration asset for the prevention of defects and damage to the tooling. The integrated user interface, with various functions such as model level monitoring, process control and recording capabilities, allows for improved process execution and repeatability of the results. The equipment also comes with automatic wafer indexing capabilities for alightning and loading of the wafers. Built with a robust frame, the system is designed for high performance and maximum accuracy and repeatability of the final results. Furthermore, the unit is designed for automatic tool maintenance to allow for improved continuity of work.