Used ENGIS 15FL110V #9248153 for sale

ENGIS 15FL110V is an advanced wafer grinding, lapping, and polishing equipment that is designed to deliver precise, versatile, and repeatable results. This system offers a fully automated process from start to finish, allowing users to quickly develop highly consistent grinding, lapping, and polishing processes with tight process control. 15FL110V is equipped with a diamond plated grinding head, which enables it to perform wafer grinding, lapping, and polishing with an extremely high degree of accuracy. The grinding head can be configured to accommodate a variety of different material types and thicknesses, as well as different grind lengths. The head is dynamically balanced for optimal operation, providing uniform grinding over the entire surface. The unit features a robust base platform that is constructed from high quality aluminum, designed for ease of installation and rigidity. This platform supports the grinding head, which is mounted on a vertically adjustable drive train. The drivetrain is controlled by a series of sensor-controlled servo motors and automated control systems to ensure optimal process control and repeatability. ENGIS 15FL110V also includes an advanced surface lapping unit with a patented dual-axis rotation machine. This tool is designed to work in unison with the grinding head to enable a variety of operations, such as backgrinding and polishing. It can also handle the thinning of wafers and thinning/polishing of multiple wafers at the same time. Finally, 15FL110V includes a polishing asset that uses a combination of cleanroom approved diamond pads and chemical polishing agents. This model can be used to achieve superior surface flatness and finish. All equipment is designed and certified to cleanroom standards and is compatible with a variety of process chemicals, providing users with the flexibility to customize their equipment to their specific needs. Overall, ENGIS 15FL110V is an advanced wafer grinding, lapping, and polishing system that provides impressive process control and repeatability, enabling users to quickly create highly accurate and repeatable results. The integrated lapping unit and polishing unit further increases its versatility and flexibility.