Used ENGIS 15FL110VP #9157002 for sale

ENGIS 15FL110VP is a robust, high-performance wafer grinding, lapping and polishing equipment designed for both production and research environments. This system is available with either a manual or an automated loading unit, both of which feature precise, repeatable operation. 15FL110VP provides extremely accurate grinding and polishing results with the lowest power and space requirements. ENGIS 15FL110VP provides a number of features designed to ensure an optimal grind, lap, and polish process. These include the patent-pending Abralam™ grinding and polishing wheels, 3500rpm head speed, and an optional vibratory pump. The machine also offers advanced diagnostics and is designed for low dust and noise levels. The grinding stage of the tool utilizes Abralam™ grinding wheels, which are capable of processing a wide variety of materials, including metals, ceramics, and polymers. The precision surface finish on the engineered surface is further enhanced by the process's low thermal load and rigorous quality control. The lapping stage of the process is provided by diamond-embedded lapping films. These films are capable of producing both low-level base flatness and high surface quality. The engraving feature of the lapping film allows for the creation of intricate patterns on the wafer surfaces. The polishing stage of the process utilizes diamond suspension liquid and rotate-able polishing pads. The diamond suspension liquid helps to reduce surface roughness and remove small particles, while the polishing pads provide a smooth, uniform finish. 15FL110VP offers a number of safety features, including the option of utilizing a protective enclosure for use in hazardous environments. The asset also provides a built-in model to prevent incorrect and unsafe operation. In conclusion, ENGIS 15FL110VP is a robust, high-performance wafer grinding, lapping and polishing equipment designed for both production and research environments. It offers precision grinding and polishing results, advanced diagnostics and safety features, and low dust and noise levels. It is capable of processing a wide variety of materials, including metals, ceramics, and polymers, to provide an optimal grind, lap, and polish process.