Used ENGIS EJ-300IN #9156519 for sale

ENGIS EJ-300IN wafer grinding, lapping & polishing equipment is designed to provide efficient and precise lapping and polishing of hard and semihard wafers up to 300mm in diameter. It is engineered to maximize repeatability and reduce downtime for manual polishing processes. This automated system enables multiple wafer grinding, lapping, and polishing in parallel. The unit includes both a throughput-oriented, large rotary surface grinder and a multiple-flap-wheel grinder. The rotary grinder is designed for both wet and dry grinding applications. It is equipped with a highly precise mechanical drive machine, with an integrated vision tool, coupled with an efficient vacuum table for dampening and cooling the sample. It features a matching diamond wheel for precise and consistent processing. An internal measurement asset monitors grinding process parameters such as speed, pressure, and grinding time. The multiple-flap-wheel grinder is designed to achieve peak production efficiency while providing high-precision grinding and polishing. The grinding wheels can be adjusted to provide optimum sharpness and uniformity over the entire surface of the wafer. A scroll wheel compresses the wheel to the surface of the wafer, providing a uniform grind across the whole of the wafer. The lapping and polishing process is driven by EJ-300IN Control Unit. The Control Unit provides automated reciprocatable end-polishing segments, automated wafer latch/unlatch, automated wafer cleaning, and automated segment speed control. The automated segment speed control allows the user to create and store finer grinding and polishing settings. ENGIS EJ-300IN wafer grinding, lapping & polishing model is highly modular and customizable, allowing for easy integration of other manufacturing processes or products. The equipment also features a built-in data logging system with a Graphical User Interface (GUI) for easy data review and analysis.The unit is designed with safety features such as an automatic dust cover and laser cutter maintenance, ensuring efficient and safe access to working areas. By providing precision lapping and polishing capabilities, EJ-300IN wafer grinding, lapping & polishing machine can help to reduce labor costs, increase throughput, and improve product yields.