Used ENGIS EJ-308IN #9215257 for sale

ENGIS EJ-308IN Wafer Grinding, Lapping & Polishing Equipment is an ideal tool for metallurgists and materials scientists in the lab or production environment. This system offers unsurpassed performance and dependability in small scale, as well as large scale polishing applications. With a flexible, yet robust design, this unit is capable of taking on a wide variety of grinding, lapping, and polishing requirements. EJ-308IN Wafer Grinding, Lapping and Polishing Machine is designed to provide a high level of precision with a wide range of wafer materials. Built upon a rigid structural frame it utilizes a diamond lapping plate that is powered by an emery wheel to gain excellent surface finish. The emery wheel is belt driven for electrically reliable speed control. This tool is also equipped with a 320,000 rpm top and bottom polishing spindles for precise control and accuracy. The durable, yet lightweight polishing chair takes on a range of wafer thicknesses and retains excellent conductivity throughout the polishing process. ENGIS EJ-308IN is an extremely reliable and efficient process that is easy to use and maintain. The digital control allows for easy programming and setup. The user friendly interface includes touch screen navigation and full asset commands. A built in recipe feature allows for multiple profile grinding, lapping, and polishing operations. Overall, EJ-308IN Wafer Grinding, Lapping & Polishing model is designed for precise control and superior performance. It allows for a fast cycle time and has a low maintenance cost. With its heavy duty construction, the equipment ensures long-lasting use and requires minimal down time during maintenance. Tamper-resistant components guarantee the destruction of valuable data should the system's polisher ever become compromised. Built for reliability, consistency and accuracy, this unit is ideal for today's metallurgists and materials scientists.