Used ENGIS EJ-380 #9257671 for sale

ENGIS EJ-380 Wafer Grinding, Lapping, and Polishing Equipment is an automated, all-in-one system designed to precise and uniform wafer surfaces for the production of next-generation semiconductors. This sophisticated machine is capable of extremely precise grinding, lapping, and polishing of a wide range of wafer sizes and diamond grits (head configuration). This unit includes a state of the art wafer chuck, capable of automatically loading and unloading wafers from the wafer chuck. It is equipped with independent servo motors, gearboxes, and encoders, allowing for greater accuracy and control during grinding, lapping, and polishing. The programming software allows for easy input of the grinding, lapping, and polishing parameters into the machine, improving process repeatability and traceability. The grind, lap, and polish components are designed to provide excellent surface quality on a variety of wafer types. The grinding spindles are designed to be durable and perform proficiently over a wide range of surface alteration. The lapping process is achieved with an abrasive diamond, which is capable of creating a precise surface finish on both sides of the wafer. The polishing is also achieved with an abrasive diamond, which is capable of producing a highly smooth and even surface. EJ-380 Wafer Grinding, Lapping, and Polishing tool also features a built-in dust removal asset. This model provides a consistent airflow through the grinding, lapping, and polishing process, taking away any particles and dust that may have created during the process. ENGIS EJ-380 Wafer Grinding, Lapping, and Polishing Equipment is designed to provide manufacturers and consumers with a reliable and consistent system for replicating a wafer surface. The precision of the unit ensures uniform and desired surface finish on each wafer and is an essential tool in the production of next-generation semiconductors.