Used ENGIS EJD-6B #9257679 for sale

ENGIS EJD-6B is a wafer grinding, lapping, and polishing equipment that provides a precise, repeatable, and cost-effective means of surface preparation for a wide range of materials. This system utilizes planetary grinding and lapping technology to rapidly complete high-precision surface preparation on a wide variety of substrates. The unit includes a planetary grinding and lapping head, a wave-form polishing stage, a variable speed drive module, a video observation camera, and a laptop computer controller. The planetary grinding and lapping head is designed to quickly and effectively grind, lap, and mill the surface of a substrate to an exact size and shape. It uses a combination of a lap platen and multi-lobed grinding wheels, mounted to a motorized spindle, to grind and lap the substrate material. The lap platen is designed to contour and round the edges of the substrate, while the multi-lobed grinding wheels reduce the surface roughness and impurities of the substrate. The variable speed drive module controls the speed of the planetary grinding and lapping head to ensure consistent machining results. The wave-form polishing stage is used to smooth out the machined surface of the substrate to prepare it for further processing. This stage utilizes an intelligent substrate position and polishing machine. Its patented Synchronous Milter Pulse Polishing technology applies pressure and vibration in precisely controlled waveforms to the substrate surface to eliminate surface imperfections. EJD-6B also includes a video observation camera that enables the operator to observe and monitor the grinding and polishing process while controlling the tool from the laptop computer controller. The laptop controller provides easy-to-use graphical interface for the operator to control any aspect of the asset with ease. ENGIS EJD-6B is ideal for surface preparation and processing of wafers, glass plates, ceramic substrates, optics, and other materials. This model can achieve up to 10,000 lapping and polishing cycles per hour and offers surface finish down to <0.25um Ra. It is the perfect choice for high-precision surface preparation for a wide range of materials.