Used ENGIS EJW-1200EFN-4AL #9156523 for sale

ENGIS EJW-1200EFN-4AL is a unique, state-of-the-art equipment that is designed for wafer grinding, lapping and polishing operations. This system has been engineered to provide a high degree of throughput and accuracy while maintaining superior quality and flexibility. EJW-1200EFN-4AL primarily consists of a grinding/lapping mechanism with four antennas for the two-sided processing of high-volume wafers. The antennas are mounted on radially adjustable cantilever arms that enable higher linear speeds and a more even wafer surface finish. Each antenna is secured to a rack-mountable frame that is enclosed in a sound-dampening cabinet, which helps to reduce process noise and promote a consistent finish. The unit can be tailored to a variety of grinding/lapping/polishing requirements. For instance, it can be configured for angle grinding/lapping, wafer surface pulverizing, and edge deburring. ENGIS EJW-1200EFN-4AL also features a pneumatic chuck that can hold up to nine heavy-duty wafer cassettes each containing a twenty-wafer cassette capacity. This allows for a dual or single-sided process of up to 800 wafers per hour. The machine's automation is powered by a PC-based control station with a user-friendly graphical interface, which is used to monitor process parameters such as loop count, positioning, and speed adjustment. Additionally, EJW-1200EFN-4AL tool can be combined with environmental control systems such as dust filtering, N2 blow-off, and cryogenic cooling to ensure that all impurities are removed during the process. In conclusion, ENGIS EJW-1200EFN-4AL is an innovative wafer grinding, lapping and polishing asset that is designed to withstand the rigors of high-volume production. It offers high accuracy, reliability, and a wide range of process options making it ideal for a variety of wafer fabrication applications.