Used ENGIS EJW-1200EFN-4AL #9181280 for sale

ENGIS EJW-1200EFN-4AL is an advanced wafer grinding, lapping and polishing equipment specifically designed to address the needs of large-scale processing in semiconductor fabrication plants. The system features a high-precision rotary tool for precision grinding, lapping and polishing of substrates, components, and devices. The unit uses a powerful circular motion brushless DC motor to generate rotational movement up to 50,000rpm providing superior polishing results and impressive throughput. The integrated machine also provides a host of advanced automated functions including process monitoring, isothermal feedback control and image processing. This allows operators to accurately monitor and control the entire process ensuring consistent high quality results. EJW-1200EFN-4AL tool utilizes unique combination of a high accuracy double gimbal belt drive, high resolution digital encoder, and advanced motion controller to provide precise and smooth motion control of the rotary tool. The double gimbal belt drive is integrated with advanced programming that allows seamless, precise, and highly programmable motion for Wafer grinding, lapping and polishing operations. The controller unit works in cooperation with the rotary tool and encoder to ensure precise operations even in harsh environments. The advanced motion control asset is further enhanced with sophisticated software tools which facilitate efficient and accurate parameterized motion paths and control strategies. With such features, processes such as edge polishing, rough grinding, grinding, honing, fine grinding, lapping and polishing can be carried out with precision and repeatability. This leads to improved product quality and repeatability as well as cost and time savings. Moreover, ENGIS EJW-1200EFN-4AL model features a variety of media for the polishing process. These include conventional cloth composites, aluminum oxide, cerium oxide, and diamond. The equipment also features an advanced slurry delivery system that provides uniform delivery of the consumable media during the polishing process. This ensures a consistent and repeatable surface finishing. EJW-1200EFN-4AL delivers impressive process performance while maintaining a high safety standard. The unit comes enclosed in a robust and ergonomic safety frame that protects operators and enables easy access to all components. In addition, the machine is designed with a modular setup that facilitates quick and easy installation and maintenance, as well as upgrades and modification. ENGIS EJW-1200EFN-4AL is thus an efficient, reliable and cost-effective solution for advanced wafer grinding, lapping and polishing processing.