Used ENGIS EJW-1200EFN-4AL #9181281 for sale
URL successfully copied!
ID: 9181281
Vintage: 2008
Lapping system
(4) Cylinder heads
Copper plate
Safety cover
2008 vintage.
ENGIS EJW-1200EFN-4AL is a state-of-the-art wafer grinding, lapping & polishing equipment designed to produce high quality, high precision wafers for today's advanced semiconductor technologies. This system is based on an ultra-high efficiency rotary unit, supporting up to three axes of motion. It has a modular design, allowing for easy reconfigurations and adaptability, while specialized functions further enhance its capabilities. At the heart of the machine is a high-resolution optically-controlled table featuring precision-ground rolling elements. This table provides smooth, consistent motion between the wafer and the grinding wheel, optimizing grinding, and polishing performance. Additionally, the table is equipped with a complete set of adjustable work stops, allowing for easy customization depending on various wafer sizes. EJW-1200EFN-4AL features a four-axis grinding and polishing head that can accommodate multiple abrasive wheels. Each wheel is mounted on a precision-machined spindle, ensuring repeatable machining accuracy. The head is connected to the table via a servo-driven linear motion stage, allowing for precise positioning of the spindle assembly relative to the workpiece. The grinding and polishing head also has a taper-lock feature that allows for fast and accurate wheel changes. This tool is further equipped with a series of advanced user-friendly control systems. An intuitive user-friendly touchscreen enables complete setup and control of the asset without complex commands. Additionally, the user can also program and store custom settings for fully automated operation. The model is equipped with various internal sensors for temperature, force, and torque, providing real-time feedback during operation. ENGIS EJW-1200EFN-4AL has an integrated dust collection equipment to keep the environment clean. This system efficiently collects debris and other particles generated during the grinding and polishing process and captures them in replaceable dust collection bags, allowing for safe and easy disposal. Overall, EJW-1200EFN-4AL is a high quality and reliable wafer grinding, lapping & polishing unit capable of producing high precision wafers with outstanding results. With its advanced features and user-friendly interface, it is the perfect machine for any semiconductor fabrication facility.
There are no reviews yet