Used ENGIS EJW-1200EFN-4AL #9224525 for sale

ENGIS EJW-1200EFN-4AL is an advanced wafer grinding, lapping and polishing equipment designed for demanding production applications. It is capable of processing up to 1500 wafers per hour, with up to 500 wafers able to be ground in a single pass. The unit has four interchangeable spindles that can process the same or different sizes of wafers with precision, including 200, 300, 350 and 500 mm. Each spindle can achieve a holding tolerance of +/- 0.001mm and features a closed-loop servo motor for greater accuracy and repeatability of results. The four modular and recirculating chambers enable quick setup and changeover times, and the patented continuous flat line processing system ensures uniform flatness. The high performance, low-vibration design makes for an exceptionally quiet machine, and the angled nozzle jets give excellent wafer edge protection. The modular and recirculating chambers also enable easy maintenance with their hinged lids and heavy-duty vacuum blower. The unit comes complete with a high-performance, advanced process controller with a large color touchscreen display for ease of use and advanced functionality. It features a data acquisition machine that is capable of real-time process and positional control, with results displayed graphically in the same display window. In addition, the controller allows for remote diagnostics and troubleshooting, as well as remote process set points and motor parameters. The tool is housed in a highly durable stainless steel frame, offering superior protection against corrosion and wear caused by high-temperature processes. The integrated upper cooling asset ensures the processing surfaces are effectively dissipated, prolonging the life of the model. EJW-1200EFN-4AL is the ideal choice for processing a wide range of medium to large diameter wafers in high volumes, with top-quality results.