Used ENGIS EJW-380-1 #9257673 for sale

ENGIS EJW-380-1 wafer grinding, lapping & polishing equipment is designed to provide a fast and economical means of producing ultra-smooth surfaces on various types of semiconductor materials. The system features a two-axis servo-controlled leader spindle drive that enables high precision surface grinding and polishing in one cycle. The spindle drive uses a direct current motor for simultaneous low and high speed operation. The unit can be programmed with various parameters such as grinding and polishing pressures, spindle speed, step duration, depth of cuts and so forth. In addition, the spindle drive can be adapted to different sizes and shapes of medical materials while maintaining optimum grinding results. The machine is equipped with a vibratory-pulsed polishing tool for surface roughness refinement. This asset is capable of achieving very low surface roughness (Ra ≤ 2nm) for different types of substrates. The model is controlled by a human-machine interface (HMI) and is equipped with online diagnostic and self-monitoring capabilities. The equipment is designed with safety features such as sound proof hoods, automatic dust-collecting systems, fire extinguish systems and air-filters. EJW-380-1 utilizes a combination of different lapping and polishing tools including belt sanders, polishing slurry, diamond slurry and diamond paste. This combination helps to reduce grinding time and provide excellent scratch-free results. The system also embraces a highly accurate calibration unit for precise wafer thickness measurement. This calibration machine includes a numeric control for automatic compensation of back grinding depth. ENGIS EJW-380-1 tool is easy to operate and maintain. The asset can be integrated with other existing systems or it can be used as a standalone model. With its high performance, high accuracy, safety features and easy to use control systems, EJW-380-1 is the perfect choice for a reliable production of ultra-smooth surfaces for various types of semiconductor materials.