Used ENGIS EJW-380IN #9207342 for sale

ENGIS EJW-380IN is a wafer grinding, lapping, and polishing equipment. It offers unmatched precision for wafer processing, particularly for the production of ultra-thin wafers. This system is capable of producing wafer thicknesses from just a few microns up to 4mm. The unit utilizes a grinding and lapping mechanism that is integrated with durable linear actuators. This mechanism is designed to accurately grind and lap the wafer surface, allowing for a high level of precision. The grinding head utilized in the machine is built to handle a large variety of grinding materials, allowing for the surface roughness and finish to be precisely controlled. The polishing head is designed to achieve micron-order accuracy by utilizing an advanced control tool and an abrasive flap disc. Integral to the asset is a high throughput chip transfer model. This allows the wafers to be moved quickly and accurately between the grinding, lapping, and polishing stages. This greatly reduces the amount of time to process each wafer. The design of the equipment also allows for easy maintenance. All components can be removed quickly and easily, making it easy to replace or repair any component of the system without downtime. The unit is fitted with advanced sensory systems to ensure complete control and accuracy throughout the entire process. Sensors monitor the size, shape, and thickness of each wafer in the machine, providing feedback to the process controller. This feedback is used to adjust the grinding, lapping, and polishing pressure as needed, helping to ensure each wafer is accurately processed to the desired specifications. EJW-380IN also features a number of process optimization features. These include a large variety of grinding, lapping, and polishing programs, allowing for quick and easy guidance and control over the entire wafer production process. The tool also features a range of wafer inspection features, which allow for the measurement and evaluation of the surface texture and finish of the finished wafer. ENGIS EJW-380IN provides a powerful yet precise wafer grinding, lapping, and polishing asset that is capable of producing high quality, ultra-thin wafers. This model can be configured to suit a wide variety of applications, making it ideally suited for the production of thin wafer products.