Used ENGIS EJW-400IFN-D #9207340 for sale

ENGIS EJW-400IFN-D Wafer Grinding, Lapping, and Polishing (WGLP) equipment is a fully automated machine designed for the preparation of semiconductor wafers for high-precision, high-yield applications. The system is designed for maximum efficiency and reliability. It provides long-term cost reductions while improving repeatable results. The unit starts with three-axis CNC grinding to produce uniform surfaces with target dimensions. This is followed by a single-axis, high-speed lapping stage to ensure parallelism and flatness of the wafer surface. The grinding wheel on EJW-400IFN-D is powered by a high-torque motor, while a separate drive controls the lapping wheel, ensuring accurate movement. This allows for fast and exact operation. Next, the machine performs backgrinding for increased material removal and minimum stress on the wafer edge. This method maximizes the accuracy of polishing and reduces the unnecessary material removal. The machine features a full automatic operation with an optical feedback tool. This ensures a uniform layer thickness across the whole wafer. Finally, the polished wafers are transferred to the polishing station. This station is specifically designed for high-precision polishing, using a special abrasive foam and spray asset. The model employs a high-precision finish, and the foam and spray equipment protect the wafer from damage during polishing. In conclusion, ENGIS EJW-400IFN-D is a fully automated, advanced Wafer Grinding, Lapping, and Polishing (WGLP) system. It provides an efficient, cost-effective process with repeatable results. The unit is designed for long-term performance and reliability, while also offering back grinding for stressing the wafer edge and fast and accurate polishing for achieving high precision.