Used ENGIS EJW-400IFN #293638669 for sale

ENGIS EJW-400IFN wafer grinding, lapping & polishing equipment is an advanced, full automation single-step synergy machine designed to meet the highest precision requirements of the semiconductor industry. It features two (2) independent high torque motors, an intuitive on-screen control system, and an interchangeable multi-axis programmable platform. The unit is ideal for producing ground-breaking advancements in ultra thin contour and profile grinding, and polishing for advanced process technology support. The machine delivers precise results with innovative high-resolution surface finish technology, capable of processing wafer sizes up to 6 inches, as well as a broad range of substrates. It is equipped with an open spindle design, which enables automatic wheel type changes in either wet or dry grinding process, and Closed-Loop Classification Control (CLCC), which efficiently allocates wheel dressing, wheel selection, and wheel wear control. The CLCC also helps maintain the lapping speed and grain distribution of the wheel, allowing highly accurate results. The tool is entirely automated, offering the ability to pre-program grinding and lapping cycles, and comes with a patented multi-axis platform, which facilitates automated wheel changes. The asset offers speed accuracy of up to 0.01mm and individual grinding/polishing operations up to 8 simultaneous axes. It also features an advanced Vision model that provides extremely detailed imaging capabilities to detect surface irregularities, as well as a powerful air recycler feature that reduces airborne particles -aiming at a clean, contamination-free environment. EJW-400IFN is equipped with an ergonomically designed A.O.S. (Adjustable Operation Equipment), a wide variety of Substrate Retention Technologies (SRT) that ensures rapid and accurate position changes during the grinding, lapping and polishing processes, and an intuitive control system (SixDoF Automation++) that allows an effortless operation and effortless cell-control environment. In addition, the unit is integrated with an Environment Monitor for controlling and monitoring process conditions. ENGIS EJW-400IFN wafer grinding, lapping & polishing machine is an advanced solution that offers the highest precision and accuracy tools to meet the intricate demands of semiconductor process technology. It is the ideal tool for producing high-quality results in the development of thin contour and ultra fine profile grinding, lapping and polishing. It features advanced features, simple integration, and cost-effective operation, making it the ideal choice for mass production.