Used ENGIS EJW-400IFN #9213789 for sale

ENGIS EJW-400IFN Wafer Grinding, Lapping and Polishing equipment is engineered to provide an efficient, economical and reliable method of accurately grind, lap and polish a wide range of wafers. This system is delivered with a high speed spindle, loop-less conveyor and an automated In-feeder/Out-feeder Handling Unit along with a choice of either a Single or Dual Platen, automated Polishing Heads that have lifters and a two-stage vacuum machine. The EJW-400-IFN is equipped with a heavy-duty spindle for main grinding operations that delivers up to 60,000 rpm when handling high frequency applications. This spindle is driven by a high-torque motor that delivers a maximum cutting force of over 400N and can be used for both wet and dry grinding applications. The machine is further fitted with a high efficiency vacuum tool that keeps powder and coolant away from the grinding surface allowing for accurate grinding results. The loop-less conveyor allows for reliable feeding and unloading of wafers, with each wafer being driven by the conveying rollers on both the in-feed and out-feed sides. This asset provides individually adjustable speed settings that help achieve accurate grinding results even when processing multiple wafers at the same time. Additionally, the conveyor is fitted with an emergency stop switch, a limit switch, and an adjustable belt tensioner for user safety. EJW-400IFN also offers a choice of either a single or dual platen grinding model that can be used for both parallel and tapered ground wafers. This equipment features programmable infeed/outfeed positions, stroke and spindle operation settings, and is expandable for future automation options. The machine also features adjustable polishing heads with lifters on the top platform for fine-alignment of wafers during the polishing process. This system is designed to be effective when used for both high precision and high-speed applications. The lapping station is equipped with a dual vacuum unit that provides both suction and blowing functions and can easily be adjusted to offer controlled discharge times. ENGIS EJW-400IFN is equipped with a heavy duty sliding table with automatic feeding functions and a wafer holder to ensure secure handling of the wafers. The machine also includes auto-correction of in-feed/out-feed positions for accuracy when polishing multiple wafers at a time. This tool is designed to efficiently handle large wafers and features a self-diagnostic asset that helps prevent hang-ups or power outages during critical stages of the grinding and polishing process.