Used ENGIS EJW-400IFN #9258273 for sale

ENGIS EJW-400IFN is a cutting-edge wafer grinding, lapping & polishing equipment designed for use in the fabrication of semiconductor wafers and wafer substrates. This system utilizes several components that work together to produce superior results, including a wafer chuck, grinding media, lapping compound, and polishing pads. The wafer chuck is the base of the unit, and it securely holds the wafers in place as the grinding and polishing process takes place. It is capable of rotating the wafers at high speed and exerting controlled, adjustable pressure on the top and bottom surfaces. The grinding media, which is composed of ceramic or abrasive particles, is used to grind away material from both sides of the wafer until the desired surface flatness is achieved. Grinding pressure is applied to the wafer during the grinding process, allowing the machine to reach extremely tight tolerances of surface roughness and flatness. Once the desired surface roughness is achieved, a lapping compound is used. This compound contains abrasive particles that further refine the surface finish of the wafer. During the lapping process, the media is attached to a robotic arm that performs the necessary motion to ensure complete coverage over both surfaces of the wafer. Once the lapping process is complete, the robotic arm removes the lapping compound and the wafer is ready for polishing. The polishing process utilizes polishing pads to further refine the surface finish of the wafer. Polishing pads are soft foam or nylon polishing discs that can further refine and smooth the surface of the wafer. The polishing pads are mounted on the same robotic arm that is used for lapping, and they rotate at high speed to gently buff the surface of the wafer. The robotic arm then destroys the polishing pads afterwards, eliminating the need for disposal and cleanup. EJW-400IFN wafer grinding, lapping, and polishing tool offers unparalleled precision and accuracy in surface preparation for semiconductor wafers and wafer substrates. It is reliable, safe, and capable of producing reliable results time after time.