Used ENGIS EJW-460SFN #9143438 for sale

ENGIS EJW-460SFN is a wafer grinding, lapping and polishing equipment designed for fabricating and producing ultra-precision components in a range of industries including semiconductor, photonics, and optics. EJW-460SFN is a multi-functional and versatile system with the ability to perform wafer grinding, lapping and polishing operations with one single machine, thus providing great user convenience and efficiency. ENGIS EJW-460SFN unit has a user-friendly graphical software interface, operated by a 10.4 inch TFT touch screen. This allows for easy navigation and programming of wafer grinding, lapping and polishing operations. In addition, non-volatile memory provides enhanced data security in the event of power failure, allowing for rapid recovery. EJW-460SFN machine is equipped with a 200mm diameter table sine dressing unit, providing support for grinding and polishing of large 300mm wafers. Multiple wafer grinding spindles are available to support processing multiple wafers in parallel and batch mode operations. The wafer grinding spindles work in combination with the grinding and polishing pads, designed to finish wafers with a minimum surface roughness of 0.2µm Ra. The tool is equipped with a full set of sensors, including auto-focus and workpiece sensors, to ensure high precision and consistent results. The asset also includes high velocity lapping discs to reduce wafer-to-wafer cycle times. With its two-stage water-cooling model, ENGIS EJW-460SFN is able to provide a stable and efficient surface finish. Finally, EJW-460SFN's ergonomic design also reduces operator fatigue due to its comfortable control panel and FOUP compatible components. With a small footprint and enhanced safety features, this equipment makes it the perfect choice for any wafer grinding, lapping and polishing application.