Used ENGIS EJW-610 #9384949 for sale

ENGIS EJW-610 is a professional wafer grinding, lapping, and polishing equipment that is designed to provide high-precision and automated processing of wafers, die, and substrates. It is equipped with a range of high-performance technology designed to increase throughput and accuracy while delivering superior surface finishes. The system has a twin motorized head that allows the simultaneous grinding, lapping, and polishing of two wafers at a time, and an optional third-player arm allows for a third wafer to be worked on simultaneously. The motorized unit and its components are computer-controlled for precise and uniform motion. It can process wafers from 200 - 600mm in diameter and 0.1 - 10mm in thickness. It is a high-precision unit and can achieve a flatness of less than 1um. It also has a honing program for achieving a superior surface finish. The machine has numerous safety features including a safety guard to ensure the operator's safety, a power interlock to disable power to the tool in the event of an emergency, and indicator lights to alert the operator of asset issues. It is also equipped with filtration and air conditioning systems to maintain a constant temperature for optimal results. In addition to the standard equipment, a range of optional components is available, such as single arm for honing substrates, a vacuum chuck, edge rounding module, water coolant, an offline loading magazine, and automatic loading model. This allows for a variety of jobs, from electrical discharge machining, lapping, polishing, and honing wafers. EJW-610 delivers reliable, consistent results every time and is the perfect equipment for the manufacture of wafers, die, and substrates. Its robust design and superior performance make it an ideal choice for a variety of industrial applications.