Used ENGIS EJW-910I #9228634 for sale

ENGIS EJW-910I is an innovative wafer grinding, lapping and polishing equipment from ENGIS. It is an automated solution that enables the precision grinding and polishing of semiconductor wafers without manual operation. This system is designed to provide uniform surface finishing of wafers, even with challenging materials. EJW-910I features a processing chamber that utilizes a 2-axis wafer motion unit with a vacuum-assisted ceramic polishing pad to ensure accurate wafer-to-wafer movement. A robotic loader transfers wafers from the magazine to the processing chamber, maintaining precise wafer positioning and alignment. With a high-speed DC motor driving the grinding/polishing process, the machine ensures the highest quality and most precise finish on each and every wafer. ENGIS EJW-910I also employs variable frequency motor operation, enabling process optimization and consistent results regardless of the material being processed. This tool also provides excellent repeatability and control of the grinding and polishing process, enabling more efficient product production. In terms of safety, EJW-910I features an industrial safety glass viewing window, providing a clear view of the work chamber at all times during operation. This asset also comes with an emergency stop button, ensuring quick and safe shut down in case of an emergency. Overall, ENGIS EJW-910I is an ideal industrial solution for high-precision wafer grinding, lapping and polishing. It provides maximum efficiency and precise results through its advanced design, safety features and variable speed operation, making it the preferred choice of many semiconductor manufacturers.