Used ENGIS EKW-4601 #9237931 for sale

ENGIS EKW-4601 is a powerful equipment designed for the purpose of grinding, lapping, and polishing of wafers in semiconductor production, resulting in a higher level of process reliability and repeatability. This system utilizes a variety of advanced technologies, allowing it to complete complex grinding, lapping, and polishing processes accurately and efficiently. The machine is equipped with a series of tooling and precision machines to complete grinding, lapping, and polishing applications. These machines are specifically designed with durability and operations in mind, in order to reduce the amount of service required. Process times and costs are minimized through the use of an efficient cart loading unit and an automatic air lift machine, which helps with fast and reliable part testing. Additionally, EKW-4601 is designed with an ergonomic layout to support maximum operator convenience. All features are easily accessible by the user, allowing for quick setup time and shorter grinding cycles. ENGIS EKW-4601 has a three-phase high torque, DC servo motor drive tool, which is capable of delivering extremely accurate and consistent results, making it an ideal asset for wafer grinding, lapping, and polishing. The model is powered by a multi-axis spindle drive, which allows for controlled motion, giving a higher degree of precision for difficult machining tasks. Moreover, this equipment is fitted with a powerful electro-pneumatic grinding control system that enables precise pressure control and automatic spindle velocity change, delivering consistent surface finish results. EKW-4601 also includes a range of automation options to increase productivity and reduce the time required to complete the grinding processes. This includes quartz wafer rotation, abrasive feed rate control, and operation of the pump unit and vacuum machine. A comprehensive monitoring tool and process control are included with ENGIS EKW-4601, providing precise parameters for process adjustment and process optimization. This asset is suitable for use with semiconductor wafers of various sizes and specification. Overall, EKW-4601 is an ideal solution for wafer grinding, lapping, and polishing, providing precision, reliability, and productivity for various applications. It is constructed with quality components and is designed to offer reliable results over extended tool life.