Used ENGIS EKW-4601FN-3AL #9237930 for sale

ENGIS EKW-4601FN-3AL is a precision, all-in-one wafer grinding, lapping and polishing equipment. Designed to meet the needs of a wide range of applications, EKW-4601FN-3AL is engineered for superior wafer processing consistency and accuracy. It combines grinding, lapping and polishing operations into a single, fully automated process, allowing for precise control over every step. The system features a variety of heads and devices that are fully programmable with customizable grinding patterns and control parameters to maximize throughput. Additionally, it includes a multi-channel waterjet cleaning unit with a unique cleaning procedure for greater efficiency. ENGIS EKW-4601FN-3AL has a user-friendly interface with a graphical LCD controller for easy setup and operation. Its 8-inch T-slot bed plate has adjustable working heights for optimized, repeatable positioning of the wafer and spindle, for maximum accuracy. The precision spindle enables dynamic grinding, lapping and polishing with up to 0.5μnm resolution over the entire process. The machine also features air-flow re-circulation and temperature management to maintain the proper temperature for the grinding and polishing process. The air-flow re-circulation helps to keep the wafers cool during processing, which results in consistent surface finish and prevent distortion. EKW-4601FN-3AL also includes an advanced auto-vibratory dicing unit to easily produce small wafers, while simultaneously preserving edge integrity and eliminating breakage, chipping and delamination. Finally, ENGIS EKW-4601FN-3AL is designed for easy maintenance, with non-contacting components, bearing-less construction, and an advanced auto-lubrication tool. With superior design, maximum accuracy and repeatability, with smooth operation and maintenance, EKW-4601FN-3AL takes precision wafer grinding, lapping and polishing to the next level.