Used ENGIS HVG-250AV #9237932 for sale

ENGIS HVG-250AV is a wafer grinding, lapping, and polishing equipment designed for use in the semiconductor and MEMS industries. The system is capable of handling 200mm and 300mm wafers with a maximum thickness of 6 millimeters. It is powered by a variable speed AC motor with a frequency range of 0 to 6,000 rpm and a maximum grinding force of 2,500 lbs. The unit is equipped with abrasive belts, diamond polishing pads, and lapping tools for fully automated and controllable grinding operations. The machine precisely controls the wafer's surface profiles allowing for hard disk drive platters and wafers to have precise flatness requirements. HVG-250AV features ENGIS microflex CNC motion control with 10-micron resolution and a high growth loop to monitor and control the wafer's surface profile. The machine is designed for low dust emissions and uses a variety of control mechanisms to achieve the desired production yields. The tool features an auto-leveling compensation, self-diagnostics, and the ability to set specific parameters for start and end grades. The asset also features an advanced angular compensation technology (ACHT) that ensures that the grinding, lapping, and polishing operations are carried out accurately and efficiently. This model also allows the operator to adjust the parameters of the grinding process according to material type and precision levels. ENGIS HVG-250AV is equipped with an automated wafer positioner that is capable of handling 200mm and 300mm wafers quickly and accurately. The equipment also monitors the wafer throughout the entire production process and allows for immediate adjustments to be made if necessary. A soft-conditioning step is also included in the system to help reduce the risk of edge damage and improve the machining efficiency. The unit is also equipped with a hazardous material handling machine to aid in safe material movement. Safety features are included in the tool such as an emergency shutoff and a two-position pressure-regulating valve to ensure that the machine does not exceed its stated safety parameters. HVG-250AV is the perfect solution for wafer grinding, lapping, and polishing applications in the semiconductor and MEMS industries.