Used ENGIS / HYPREZ 15LM115V #9213806 for sale

ENGIS / HYPREZ 15LM115V Wafer Grinding, Lapping & Polishing Equipment is a high-precision finishing machine designed to provide excellent performance and uniformity on a range of various materials, including semiconductor, glass, ceramic, and silicon wafers. ENGIS 15LM115V is a self-contained unit that can accommodate samples up to 115mm in diameter with a maximum grind depth of 1mm. The system is equipped with an advanced digital controller which gives users the ability to customize the grinding and lapping process and access real-time performance data. HYPREZ 15LM115V unit is designed to help reduce the cost of wafer processing by providing a quick, easy, and efficient process. It features a small footprint that is easy to maneuver around and can be set up in almost any environment. The machine is powered by a 2 horsepower, adjustable speed grinder, capable of operating at speeds between 250 and 600 RPM. Additionally, the tool has a low-vibration sine wave profile that helps minimize chatter and maximize accuracy. 15LM115V asset has two independent grinding stages and a custom lapping plate, which allow users to precisely and efficiently shape and finish wafers of various thicknesses and sizes. This combination ensures uniform surface finishes and excellent uniformity between each layer of the sample. ENGIS / HYPREZ 15LM115V is equipped with an intuitive and easy-to-use control interface that allows users to create customized grinding and lapping parameters for a variety of different materials and samples. This powerful controller also features a user-friendly menus, a range of safety functions, and real-time performance data that help users manage and optimize their grinding and lapping processes. The model's heavy-duty construction and premium materials provide excellent durability and longevity, while the unit's silent operating mode helps to minimize noise and vibration levels. ENGIS 15LM115V also includes an integrated vacuum equipment with dust collection and filtration system that helps keep the environment clean and safe. HYPREZ 15LM115V is a powerful, reliable, and cost-effective wafer grinding, lapping, and polishing machine that is designed to help wafer manufacturers reduce costs and increase efficiency. Its advanced control unit and intuitive interface make it easy to use, and its robust design ensures longevity and superior performance.