Used ENGIS / HYPREZ 42SIM 230VP #9164600 for sale

ENGIS / HYPREZ 42SIM 230VP is a highly versatile wafer grinding, lapping, and polishing equipment specifically designed for applications involving high precision surface finishes on a variety of substrates, such as semiconductor wafers, quartz, and other materials. The system features a 42-inch wheel capable of providing a 21,000 RPM speed for grinding, lapping, and polishing operations. A 230 liter per minute high-velocity vacuum pumping unit is also included to enable fast and thorough tablet processing. ENGIS 42SIM 230VP can be easily adjusted for a variety of process-specific applications. The grinding head uses an adjustable depth stop and electromagnetic braking, while the grinding wheel is specially designed for ease of adjustment. The machine also includes a user-friendly digital control panel that features intuitive programming and precision adjustable parameters, allowing for fine tuning and optimal results. The lapping station of the machine offers a multi-station layout on a unique wafer-indexer with simultaneous wafer processing from both top and bottom grinding heads. This enables simultaneous lapping of both sides of the wafer, saving time on each process run. The lapping station is equipped with a precision automatic wafer loading, and a vacuum transport tool for precise media transport and easy wafer withdrawal. The polishing station of HYPREZ 42SIM 230VP offers a variable speed platen and adjustable gap for high accuracy surfaces. This station includes an electronic angle adjustment from 0.4 to 12 degrees, allowing for variable pressure and grind/polish angle. Additionally, the asset includes a monitor arm with digital angle indicator for precise control of the polishing process. Overall, 42SIM 230VP is an advanced wafer grinding, lapping and polishing model specially designed to deliver the highest precision surface finishes with minimal material accumulation. This equipment is the perfect solution for those who need to achieve precise surface finishes on semiconductor materials, quartz, and other substrates.