Used ENGIS / HYPREZ EJW-400IN #9257672 for sale

ENGIS / HYPREZ EJW-400IN
ID: 9257672
Vintage: 2003
Single sided wrapping machine No facing 2003 vintage.
ENGIS / HYPREZ EJW-400IN is a wafer grinding, lapping and polishing equipment that is designed to produce high-precision parts and devices. This system is capable of performing a variety of grinding, lapping and polishing operations with precision and repeatability. The grinding, lapping and polishing processes are typically used to produce parts from semiconductors, glass, and ceramics for electronics, optics, pharmaceutical, and medical device applications. ENGIS EJW-400IN unit produces components that require ultra-fine finish and precise form. The components are used in device fabrication, such as semiconductor and optoelectronic circuits. HYPREZ EJW-400IN wafer grinding, lapping and polishing machine is equipped with an excellent spindle bearing tool and an adjustable bearing preload to provide accuracy and stability. To ensure efficient and repeatable grinding, lapping and polishing results, the asset also features high torque, speed accuracy of +/- 5%, and adjustable down feed. The model also features two grinding heads that are easy to change and a variety of different grinding wheel speeds. This allows for a wide range of grinding and lapping techniques and fine-tuning of the grinding parameters. EJW-400IN equipment is also capable of producing mirror-like finishes for a variety of wafer sizes. To achieve this, the system is equipped with a polishing head capable of achieving high-precision polishing. The polishing head is adjustable to match the flatness and finish of the substrate. In addition, the unit has an optional vacuum chuck that holds the wafer firmly in place during the grinding, lapping or polishing process. This ensures that the wafer does not slip out during the operation and helps to improve the process yield. In conclusion, ENGIS / HYPREZ EJW-400IN wafer grinding, lapping and polishing machine is a high-precision production tool capable of producing ultra-smooth surfaces and high accuracy parts and components. This tool provides users with the necessary versatility and precision to manufacture complex and intricate parts and devices.
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