Used ENGIS JAPAN EJW-1200EFN-4AL #9208902 for sale

ENGIS JAPAN EJW-1200EFN-4AL Wafer Grinding, Lapping & Polishing equipment is a fully-automated, high-performance system designed to achieve superior surface finish and flatness on all types of semiconductor and MEMS wafers. The unit is equipped with four (4) programmable grinding/polishing heads, each capable of 16 different grinding/polishing operations for a total of 64 possible combinations. The machine also includes two (2) lapping positions to achieve a superior finish on the wafer surface at a high rate of speed. EJW-1200EFN-4AL features an intuitive and user-friendly Graphical User Interface (GUI) for programming, monitoring and troubleshooting. The tool also utilizes a touch-screen control asset through a variety of interfaces, offering both a clean user interface and the facility to intuitively edit existing processes or set up new ones. The model is also equipped with a variety of safety features, including a safety door interlock equipment, as well as temperature and humidity sensors. Additionally, the system has been tested to ensure compatibility with a variety of standard GR- and MQ- based work holders and load slides. The unit utilizes a linear driven reciprocating movement for vehicle movements, as well as a linear driven indexing mechanism that can provide up to 512 programmable positions and/or settings for both the grinding and lapping stages. The machine is capable of grinding and lapping wafers as thin as 20 microns in thickness, with a total diameter range of 25mm to 300mm. The tool also allows for a wide variety of different quality assurance parameters, including the ability to measure arbitrary job times, endpoints, number of completed jobs, total gratings, total re-grindings, and data for a variety of other parameters. The asset is designed to be compliant with ISO9001:2015, and certified replacements parts are available. This model is capable of performing a variety of processes, including surface finish polishing, 1/4 and 1/2 pitch angle grinding, reversed angle grinding, and track blending.