Used ENGIS JAPAN EJW-1200EFN-4AL #9257670 for sale

ENGIS JAPAN EJW-1200EFN-4AL is a sophisticated wafer grinding, lapping & polishing equipment designed to accommodate the needs of today's most exacting semiconductor equipment manufacturers and sub-contractors. This system is completely enclosed in an all-in-one design, and is capable of grinding and polishing wafers up to 12" in diameter with a minimum outer diameter of 3.175 mm. It is also capable of lapping wafers up to 11.5" in diameter with a minimum outer diameter of 0.055 mm. The grinding unit consists of two main components: an automated wafer grinding wheel and a robust lapping wheel. Both are driven by an advanced drive machine and fully integrated into a single machine, providing quick and precise outputs. The lapping wheel is made from a variety of materials, and can be tailored to the application by controlling the size, shape, and abrasive type. This allows the user to fine tune the output to their specific needs. EJW-1200EFN-4AL also offers a variety of polishing processes. Through finely tuning the pressure of the polishing head, users can achieve high levels of surface finish. The tool also offers an automated polishing cycle with controllable processing parameters for uniform and efficient results. Finally, ENGIS JAPAN EJW-1200EFN-4AL machine is equipped with a precision feed asset for wafer handling. This features an integrated pre-wetting model and a fully automated cleaning equipment to ensure optimal results and extended machine life. The entire system is backed by ENGIS's comprehensive service and support team providing a global network of technical and service support. Overall, EJW-1200EFN-4AL is an impressive piece of technology, capable of producing high quality wafers in a fast and efficient manner. Its all-in-one design, variety of polishing processes, and comprehensive service support make it an excellent option for any facility looking to produce wafers with superior surface finish.